Dual Interface/Hybrid Technology

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Smart Packaging Solutions presents “Suncombi” platform, a new technology for secured & reliable Dual Interface Card.

 

 

 

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What is “Suncombi” technology platform ?

This technology is based on a specific electromagnetic coupling between an antenna module ("Suncombi" module) and a specific antenna (E-Booster®).
The “Suncombi” module is embedded in the card with the E-Booster®.

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Revolutionary for dual interface technology.

The reliability weakness of a common dual interface card is the interconnection between the micro-module and the antenna embedded into the card body.
With “Suncombi” technology, there is no more interconnection between the module and the antenna. The final products are extremely solid and offer mechanical characteristics never achieved before.
It is the easiest way to manufacture dual interface cards. The embedding step is a standard process used to embed contact module (high throughput & Yield).

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The Hybrid Solution, which includes two dies, offers the same level of durability and flexibility.

Outstanding features

• With “Suncombi” technology, no more contact between micromodule & antenna embedded into the card
• High reliability: up to 25 ISO 10373 in standard bending tests (2 for the common technology)
• Contactless applications :
  • Identity (ID, heathcare driving license card…)
  • Banking (Paypass)
  • Commodity, transport, access control
  • Loyalty
  • Different sizes of modules (M4 format…)