High memory platform

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Smart Packaging Solutions offers High Memory and Multicomponent micromodules. This platform for smart products can provide high memory storage, but also a whole host of features. This platform is available on different form factors such as micromodules in reels, cards, inlays or all other form factors according to the customer’s request.

 

What is the High Memory & Multicomponent Platform ?

This technology is based on a specific coupling between an integrated circuit component (for example a chip for smart card) and one or several passive components, in only one micromodule.

The various passive components are:

1. Flash memories: to increase the storage capacity of the product (up to several Gigabytes of data)
2. Ultra-low profile passive components (resonator, capacitor, resistance): to improve the communication speed and the reliability of the product.
3. Sensors: to permit different kind of analysis.

Thanks to the reel-to-reel component assembly technology – of which SPS is a pioneer, the thin and flexible smart device productivity is highly improved.
The platform is available in different form-factors fully compliant with smart card standards, minicards, contactless cards, or any other products.

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Main features :

• High and secure memory storage
• Communication speed
• Smart packaging: all sized, numerous components
• Flexible and thin device with high-level of reliability
• Contact (ISO/USB/MMC/SWP) and/or Contactless communication(13,56 MHz)

 

• Application
• Telecommunication
• Multimedia
• Identity
• Healthcare
• Access control
• …