Full contactless Inlays

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Smart Packaging Solutions presents Full contactless inlays with a new technology for secured & reliable contactless products.

 

 

 

What is “E-Booster®” technology platform?

This technology is based on a specific electromagnetic coupling between an antenna module (E-Pastille®) and a specific antenna (E-Booster®).
E-Pastille® is a highly reliable, flexible and thin microelectronic packaging. E-Pastille® is totally flat and its thickness is uniform.

E-Pastille® can be easily integrated in plastic inlays, Teslin or paper and may be inserted inside the cover, inside the biographical data page or inside the centre spread (flexible embedding).
The antenna material may be associated with copper, aluminum or screen printing antennas.
This solution is also ideal for Visa documents.
The toughest solution for durability and security.
Electronic passports using this technology are very robust and highly protected against damage and tampering (it is not possible to use heat freezing or any chemical solvent to remove layers without irreparable damage).
The E-Booster® incorporates security features that prevent from counterfeiting and falsification.
The usual interconnection between the chip module and the antenna (by soldering, thermo-compression or electrically conductive adhesive) is not reliable and not long-lasting.

With the E-Booster® platform, there is no more interconnection between the 2 elements (high reliability).
E-Pastille® & E-Booster® can be inserted in 2 different parts of the passport:
The cover page contains only the E-Pastille®. The E-Booster® is located in the biographical data page.

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Outstanding features

• The highest reliability & tamper evidence solution for electronic passports
• Flexible solutions according to customer's requirements
• Maximum reading distance up to 8 cm
• High Speed Data processing up to 848 kbps
• Available on 2 up and 4 up form factor
• Total Thickness 400µm