ROUSSET, FRANCE, June11, 2012 - Smart Packaging Solutions’ Embedded Contactless Module is now available for mass production. This patent-protected technology from SPS allows Identity
Document producers to manufacture contactless smart cards the same way, and with the same equipment as contact cards, thus leading to better quality cards and higher yields.
Read MoreSPS and Bsmart partner for dual technology banking cards in Latin America
ROUSSET, FRANCE, May 7, 2012 - Smart Packaging Solutions is pleased to announce that Bsmart, a Brazilian company involved in secure transaction markets, has been appointed as its Agent for the Latin America and Caribbean area.
Read MoreSPS brings reliable dual technology for China smart card migration
ROUSSET, FRANCE, March 26, 2012 – Smart Packaging Solutions is ready for China migration to smart (Chip and PIN) banking cards. The Chinese Government, along with PBOC (People’s Bank of China) already confirmed all banking cards in China would use smart card technologies by 2015.
Read MoreSPS makes banking card integration easier with 15 Visa and MasterCard certifications in 2011
ROUSSET, FRANCE, March 5, 2012 - Smart Packaging Solutions expertise in dual-interface has been recognized again with 15 additional Visa and MasterCard certifications obtained in 2011. Thanks to SPS technology, smart card manufacturers are ideally positioned to deliver payment cards worldwide and especially to benefit from the EMV migration in North America.
Read MoreSPS wins a Sesames 2011 award
ROUSSET, FRANCE, Tuesday 15th November 2011 - Embedded Contactless Module - Smart Packaging Solutions
SPS embedded contactless module is an alternative manufacturing process to the “traditional way” based on inlay technology.
Read MoreContactless cards take over the smart card world with dual interface solution leading the way
London - 14 November 2011- The high degree of interconnection in the modern world drives the use of authentication technologies, which should not only be secure but also fast. Governments and other stake holders have increasingly adopted smart cards to manage a shift from security to convenience.
Read MoreSPS Ships its 20 Millionth Contact & Contactless EMV Platform
ROUSSET, FRANCE, Monday 7th November - Smart Packaging Solutions has already shipped 20 million of its E-Booster® dual interface platforms dedicated to dual-technology (contact & contactless) banking cards.
Read MoreSPS finalist of the Sesames 2011 awards
ROUSSET, FRANCE, Wednesday 19th, September 2011- SPS is a finalist of the 2011 Sesames Awards with its Embedded Contactless Module, in the category Identification / ID Cards.
La "e-carte" d'identité arrive
ROUSSET, FRANCE, Satarday 9th July 2011 - Fabricants de puces, de lecteurs ou Imprimerie nationale, les industriels se disent fin prêts pour l'arrivée de la carte d'identité électronique, votée cette semaine par l'Assemblée, qui sera fabriquée avec des composants en grande majorité d'origine française.
Read MoreLa nouvelle carte d'identité française sera biométrique
ROUSSET, FRANCE, Friday, 8th July 2011 - La carte d'identité sera donc bien biométrique. L'Assemblée nationale a adopté hier en fin d'après-midi la proposition de loi relative à la protection de l'identité, donnant ainsi naissance à ce nouveau document qui remplacera peu à peu la carte d'identité actuelle.
Read MoreCPI Card Group Introduces a New Secure Dual Interface EMV Solution
ROUSSET, FRANCE, Tuesday 14th June 2011 - CPI is also proud of being the only manufacturer in North America offering the Smart Packaging Solutions (SPS) reliable technology for the dual interface card construction.
Read MoreCommunication from FCDE, Imprimerie Nationale and SPS
ROUSSET, FRANCE,Monday, 17th January, 2011 - Imprimerie Nationale Group invests 2 million Euros in Smart Packaging Solutions and joins the « Fonds de Consolidation et de Développement des Entreprises » (FCDE) as reference shareholder of SPS.
Read MoreCommunication FCDE, Imprimerie Nationale et SPS
ROUSSET, FRANCE, Monday 17th January 2011 - Le Groupe Imprimerie Nationale (IN) investit 2 millions d’euros dans Smart Packaging Solutions (SPS). Il rejoint ainsi le Fonds de Consolidation et de Développement des Entreprises (FCDE) comme actionnaire de référence dans le capital de la société.