Smart Packaging Solutions (SPS) has accomplished a new word’s first! SPS champions integration with Dual 6, its new small-size micromodule dedicated to dual interface cards.
ROUSSET, FRANCE, November 11, 2015 – Smart Packaging Solutions, a world leader in dual interface banking and eID documents, is expanding its offer with eBoost PAY® Dual 6, its latest development in terms of micromodule for dual interface cards. SPS Dual 6 micromodule is exactly the size of a regular 6-contact micromodule, such as the ones used for SIM or contact banking cards. For this reason, thanks to Dual 6, card manufacturers can easily switch from contact to dual interface cards, without any need for adapting the embedding machine on their manufacturing line.
Many financial institutions have developed their artwork for payment cards based on 6-contact micromodules used with contact cards. Thanks to Dual-6, banks are able to evolve from contact to dual interface cards without any change in their artwork.
With Dual 6 and thanks to SPS inductive coupling technology, smart card manufacturers benefit from economies of scale as they can have a general-purpose smart card manufacturing line that will produce all kind of 6-contact smart cards, bringing them the best flexibility and production chain efficiency to answer card issuers’ demands.
Stéphane Semori, Product Manager for Banking, at SPS, declares: “After being a pioneer in inductive coupling mass deployment with the eBooster Product Line, we are very proud to bring again to our clients a new leading advantage to address the needs of their customers”.
Dual 6 is EMVCo and MasterCard CQM (Card Quality Management) compliant. Dual 6 is already available in either gold or silver plating.
Dual 6 is part of the eBoost PAY® product line, which offers a unique and patented technology for secure and reliable payment and transport cards enabling a contact & contactless interface. The eBoost PAY® product line built upon SPS numerous references for payment and transport applications, includes dual interface modules (Dual 6 and Dual 8) and inlays, S-Lam® and Sub-Lam®. Already, SPS customers have received more than 45 currently active certifications or type approvals from payment networks for their products associating various chips from all semiconductor vendors, with different operating systems.
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SPS will be exhibiting on booth 4L061, at Cartes Secure Connexions on November 17-19, in Paris Nord Villepinte, France. |
About SPS
Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, with a subsidiary in Singapore, SPS employs 120 people. Part of the French group ‘Imprimerie Nationale’, the company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at www.s-p-s.com
Contact
Olivier BRUNET, Product & Marketing director, SPS,
contact@s-p-s.com,
Phone: +33 4 42 53 84 44
SPS is part of the Imprimerie Nationale Group
About the Imprimerie Nationale Group
The Imprimerie Nationale Group is a high tech company, expert in engineering solutions for official credentials, the global management of identities and rights, the protection of sensitive data and controlling flows and complex printing processes.
The Imprimerie Nationale Group supports organisations in the public and private sectors in the production of credentials, the securing of documents and in the integration of trust services technological solutions. The Imprimerie Nationale produces more than 25 million secure credentials each year, including the French biometric passport.