SPS Ships its 20 Millionth Contact & Contactless EMV Platform

ROUSSET,FRANCE, Monday, 7th November 2011- Smart Packaging Solutions has already shipped 20 million of its E-Booster® dual interface platforms dedicated to dual-technology (contact & contactless) banking cards.

Smart Packaging Solutions (SPS) is proud to announce it has already shipped more than 20 million of its E-Booster® platforms to smart card manufacturers serving the banking card market worldwide.

Large and small smart card manufacturers are adopting SPS E-Booster technology to support demand from financial institutions for dual-technology (contact & contactless) banking cards. With its E-Booster® technology, SPS delivers EMV platforms consisting in a smart card module with a small embedded antenna, and an inlay with a larger antenna. Financial institutions worldwide have already announced and started rollouts of dual technology EMV cards allowing consumer to benefit from the advantages of both contact and contactless technologies. For instance, payment associations and banks in Canada, Poland, Australia and the UK are already distributing dual technology payment cards on a massive scale.

The E-Booster® technology allows smart card manufacturers of all sizes to deliver high-performance dual technology cards to financial institutions issuing banking cards. The platform SPS delivers to its customers consists in a micro-module with contacts for EMV contact transactions integrating a small antenna, and an inlay with a full card size antenna, coupled with the small antenna, allowing an efficient errorless communication in contactless mode between the card and the reader. This way, and because there is no physical connection between both antennas, cards are reliable, and even allow five lines of embossing in the ISO defined area. Thanks to the E-Booster® technology, smart card manufacturers are able to deliver dual technology contact & contactless cards without costly investments in their production chain. They can easily integrate a stable process that guarantees high yield rates for their dual interface card embedding process.

“Thanks to its E-Booster® technology, and its production lines of micro-modules, SPS delivers a high level of service and supports its customers throughout the certification process. This exclusive combination of technology and service will reinforce our position as a leader for dual interface solutions on the banking market”, said Philippe PATRICE, CEO of SPS.

About SPS
With more than 20 years of experience in the field of smart card technologies, Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e- passport and dual interface banking cards. Headquartered in Rousset, France, SPS employs 80 people. The company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at http://s-p-s.com/