ROUSSET, FRANCE, March 5, 2012 - Smart Packaging Solutions expertise in dual-interface has been recognized again with 15 additional Visa and MasterCard certifications obtained in 2011. Thanks to SPS technology, smart card manufacturers are ideally positioned to deliver payment cards worldwide and especially to benefit from the EMV migration in North America.Read More
ROUSSET, FRANCE, Tuesday 15th November 2011 - Embedded Contactless Module - Smart Packaging Solutions SPS embedded contactless module is an alternative manufacturing process to the “traditional way” based on inlay technology.Read More
London - 14 November 2011- The high degree of interconnection in the modern world drives the use of authentication technologies, which should not only be secure but also fast. Governments and other stake holders have increasingly adopted smart cards to manage a shift from security to convenience.Read More
ROUSSET, FRANCE, Monday 7th November - Smart Packaging Solutions has already shipped 20 million of its E-Booster® dual interface platforms dedicated to dual-technology (contact & contactless) banking cards.Read More
ROUSSET, FRANCE, Wednesday 19th, September 2011- SPS is a finalist of the 2011 Sesames Awards with its Embedded Contactless Module, in the category Identification / ID Cards.
ROUSSET, FRANCE, Tuesday 14th June 2011 - CPI is also proud of being the only manufacturer in North America offering the Smart Packaging Solutions (SPS) reliable technology for the dual interface card construction.Read More
ROUSSET, FRANCE,Monday, 17th January, 2011 - Imprimerie Nationale Group invests 2 million Euros in Smart Packaging Solutions and joins the « Fonds de Consolidation et de Développement des Entreprises » (FCDE) as reference shareholder of SPS.Read More