SPS offer now includes certified banking platform based on STMicroelectronics solution

Smart  Packaging  Solutions  announces  the  addition  of  STMicroelectronics
solution dual interface certified platform to its banking card offer. This way,
SPS  customers  benefit  from  the  cost  advantage  of  SPS  EBooster  technology
and are able to satisfy a wider scope of demand from financial institutions.  
ROUSSET,  FRANCE,  April  22,  2013  -  Smart  Packaging  Solutions  is  happy  to
announce the addition of a new dual interface platform EMV certified solution to
its offer.  
This  dual  interface  EMV  solution  allows  card  manufacturers  to  propose  dual
interface banking cards based on a JavaCard operating system, fully certified by
Visa, MasterCard and Interac. This platform is now qualified by SPS, and can be
delivered to card manufacturers, enabling them to benefit from the EBooster®
Olivier  Brunet,  Product  and  Marketing  director  at  SPS,  declares:  “With  the
addition of this platform based on STMicroelectronics solution, our customers are
given more options to ensure they satisfy the booming demand for dual interface
banking cards. This choice of platforms associated with the manufacturing cost
reduction brought by SPS EBooster® technology ensures card manufacturers are
in the best position to answer market demand”.
With this addition, thanks to SPS EBooster® technology and modular approach,
smart card manufacturers are given a full set of options: they can select between
major  semi-conductor  vendors,  and  choose  native,  JavaCard  or  Multos  based
operating systems. This way, smart card manufacturers are able to adapt easily
to the complexity of market demand and ensure they are able to deliver banking
cards fitting all financial institutions requirements.  
With  this  modular  approach,  SPS’s  customers  are  ideally  positioned  to  benefit
both from mature smart card based banking markets, for instance in Europe, Asia
or  Latin  America,  and  from  upcoming  developments  such  as  the  United  States
and China.  
SPS EBooster® technology allows smart card manufacturers of all sizes to deliver
reduced-cost  high-performance  dual  technology  cards  to  financial  institutions
issuing banking cards. SPS platform consists in a micro-module with contacts for
EMV  contact  transactions  integrating  a  small  antenna,  and  an  inlay  with  a  full
card  size  antenna,  coupled  with  the  small  antenna,  allowing  an  efficient
communication in contactless mode between the card and the reader. This way,
and because there is no physical connection between both antennas, cards are
highly reliable, and even allow five lines of embossing in the ISO-defined area.
Thanks to the EBooster® technology, smart card vendors are able to deliver dual
technology  contact  &  contactless  cards  without  costly  investments  in  their
production line. They can easily integrate a stable process that guarantees high
yield  rates  and  reduced  unit  manufacturing  costs  for  their  dual  interface  card
embedding process.  
About SPS
With more than 20 years of experience in the field of smart card technologies,
Smart Packaging Solutions is specialized in the design, manufacturing and sale of
contactless solutions dedicated to ID cards, e-passport and dual interface banking
cards. Headquartered in Rousset, France, SPS employs 100 people. The company
specializes  in  contactless  and  dual-interface  products,  with  a  recognized  micro
packaging  expertise.  SPS  has  filed  over  120  patents  supporting  its  exclusive
technologies. More information at www.s-p-s.com
Olivier  BRUNET,  Product  &  Marketing  director,  SPS,  contact@s-p-s.com,  
tel: +33 4 42 53 84 44