Smart Packaging Solutions (SPS) is proud to announce that its EBooster® technology has been certified by most international and national payment networks, thus demonstrating its versatility in terms of semiconductor suppliers, operating systems and smart card manufacturers.
ROUSSET, FRANCE, March 18, 2014 - SPS EBooster® technology for dual interface cards (contact and contactless) makes banking card manufacturing easier and less costly. Moreover, the technology, with no physical connection between the micro-module and the card antenna, ensures that cards delivered to end-users are more reliable.
SPS EBooster® technology is semiconductor vendor agnostic: smart card manufacturers have already been using SPS EBooster® technology with chips delivered by all leading semiconductor vendors recognized in the secure transactions industry.
SPS EBooster® technology is totally independent from the operating systems and the payment applications. Products associating both proprietary and standard operating systems have already been certified by all major international and national payment networks.
As a result, SPS customers have received more than 45 currently active certifications or type approvals from payment networks for their products associating various chips from all semiconductor vendors, with different operating systems. Each “Letter of Approval”, delivered by a payment network covers a different combination between card manufacturers, semiconductor sources, and operating systems, all of them enjoying the benefits of the recognized SPS EBooster® technology. In addition, 25 more certifications are currently in progress, demonstrating a growing acceptance of SPS technology.
“Our EBooster® process demonstrates our technology is totally semiconductor agnostic and operating system independent. The process has been successfully implemented by numerous smart card manufacturers who have seen their product recognized by all major payment networks,” says Philippe Patrice, SPS Chief Executive Officer.
In related news, SPS will exhibit on booth F17, in CARTES Secure Connexions Asia, taking place in Hong Kong, SAR, China, on March 19-20, 2014.
SPS EBooster® technology allows smart card manufacturers of all sizes to deliver reduced-cost high-performance dual technology cards to financial institutions issuing banking cards. SPS platform consists in a micro-module with contacts for EMV contact transactions integrating a small antenna, and an inlay with a full card size antenna, coupled with the small antenna, allowing an efficient communication in contactless mode between the card and the reader. This way, and because there is no physical connection between both antennas, cards are highly reliable, and even allow five lines of embossing in the ISO-defined area. Thanks to the EBooster® technology, smart card vendors are able to deliver dual technology contact & contactless cards without costly investments in their production line. They can easily integrate a stable process that guarantees high yield rates and reduced unit manufacturing costs for their dual interface card embedding process.
With more than 20 years of experience in the field of smart card technologies, Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, SPS employs 120 people. The company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at www.s-p-s.com
Olivier BRUNET, Product & Marketing director, SPS, email@example.com,
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