SPS makes banking card integration easier with 15 Visa and MasterCard certifications in 2011

ROUSSET, FRANCE, March 5, 2012 - Smart Packaging Solutions expertise in dual-interface has been recognized again with 15 additional Visa and MasterCard certifications obtained in 2011. Thanks to SPS technology, smart card manufacturers are ideally positioned to deliver payment cards worldwide and especially to benefit from the EMV migration in North America.

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SPS wins a Sesames 2011 award

ROUSSET, FRANCE, Tuesday 15th November 2011 - Embedded Contactless Module - Smart Packaging Solutions SPS embedded contactless module is an alternative manufacturing process to the “traditional way” based on inlay technology.

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Contactless cards take over the smart card world with dual interface solution leading the way

London - 14 November 2011- The high degree of interconnection in the modern world drives the use of authentication technologies, which should not only be secure but also fast. Governments and other stake holders have increasingly adopted smart cards to manage a shift from security to convenience.

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SPS Ships its 20 Millionth Contact & Contactless EMV Platform

ROUSSET, FRANCE, Monday 7th November - Smart Packaging Solutions has already shipped 20 million of its E-Booster® dual interface platforms dedicated to dual-technology (contact & contactless) banking cards.

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SPS finalist of the Sesames 2011 awards

ROUSSET, FRANCE, Wednesday 19th, September 2011- SPS is a finalist of the 2011 Sesames Awards with its Embedded Contactless Module, in the category Identification / ID Cards.

Cartes 2011 Identification / ID Cards finalists